Description

Features
■ 4 Low Power CMOS 512K x 8 SRAMs in one MCM
■ Factory configured as 512K x 32; User configurable as 1M x 16 or 2M x 8
■ Input and Output TTL & CMOS Compatible Design
■ Fast 17,20,25,35,45,55ns Access Times
■ Full Commercial, Industrial and Military (-55°C to +125°C)
Temperature Range
■ MIL-PRF-38534 Compliant MCMs Available
■ +5 V Power Supply
■ Available in two Surface Mount Packages, and two PGA Type Package
● 68–Lead, Low Profile CQFP(F1), 1.56″SQ x .140″max
● 68–Lead, Dual-Cavity CQFP(F2), 0.88″SQ x .20″max
(.18 max thickness available, contact factory for details)
(Drops into the 68 Lead JEDEC .99″SQ CQFJ footprint)
● 68–Lead, Single-Cavity CQFP (F18), .94″SQ x .140″max (Drops into the 68
Lead JEDEC .99″SQ CQFJ footprint)
● 66 Pin, 1.38″ x 1.38″ x .245″ PGA Type, Aeroflex code# “P1″
● 66 Pin, 1.09″ x 1.09″ x .185” PGA Type, With Shoulder, Aeroflex code# “P7”
■ Internal Decoupling Capacitors
■ DESC SMD# 5962–94611 Released (F1,F2,F18,P1,P7)